Semiconductor/SMT/
Electronic parts
Semiconductor/SMT/electronic components
In the production of semiconductor devices, reliable bonding of the die (chip) and substrate and precise coating are important.
Our advanced dispensing technology and controls help improve product reliability and performance.
problem
- When applying conductive paste or adhesive to semiconductor chips, it is necessary to use a very small amount and precisely control the application.
- If the coating thickness is not uniform, uneven gaps may occur in the bond between the chip and the substrate, potentially affecting functionality.
- Since the conductive paste is expensive, we want to eliminate waste of liquid and reduce costs.
Benefits
- The electromagnetic drive system achieved high-speed and stable drive, allowing the semiconductor chip manufacturing process to be highly controlled.
- Uniform and highly accurate coating was achieved, ensuring accurate operation and signal transmission of semiconductor chips.
- The dead volume is small, reducing waste of conductive paste, and allowing expensive paste to be applied to the end without wasting it.
Introduced products
High-speed electromagnetic control non-contact dispenser NOVADOT
- Renovated structure allows easier setup and improves dispensing reproducibility when replacing syringes.
- Newly designed high-power engine improves discharge accuracy
- Equipped with an air circuit for engine cooling, improving stability during continuous discharge.
- Built-in nozzle heater improves temperature control efficiency
- Equipped with an optional control socket as standard, allowing external control
Nozzle proximity type dispenser
A pool of liquid forms at the tip of the nozzle and adheres to other mounted components.
As the liquid spreads after being discharged, it adheres to other mounted components.
Because the nozzle is inserted into the side of the chip, the fillet becomes large.
problem
- Difficult to accurately apply to dense, fine areas, resulting in extended coverage and potential for coating on top of chips or other components.
- It is necessary to quickly apply underfill in the form of fine dots, but frequent application was sometimes unstable.
Benefits
- Accurate application to minute areas that the nozzle tip cannot reach has been achieved. This makes it possible to fine-tune the fillet range and eliminates the possibility of the fillet flying to non-coated areas.
- The on-fly jet enables high-frequency coating to be performed stably, improving product productivity and reducing costs.
Introduced products
High precision non-contact dispenser BEATRUM
The high-precision jet dispenser BEATRUM achieves both stable micro-amount dispensing and ultra-high-speed tact.
- Available from low viscosity to high viscosity
- loaded volume
- Abundant optional nozzles
- Reduces bubbles when applying coating agent
- Easy cleaning with fewer parts in contact with liquid
- Stable dispensing up to 250Hz
interactive digital showroom
- Avoids damage to chips etc. due to nozzle contact
- No deformation of the nozzle occurs
- No liquid dripping
- No need to manage Z-axis
